February always features two conferences important to the Semiconductor Manufacturing World: The SPIE Advanced Lithography Conference and ISSCC, EUV Lithography featured prominently at the former and an update on Samsung’s 3D-NAND was presented at the latter.
Tag Archive: VNAND
Samsung were well ahead of their competitors in the mass memory market when they announced the volume manufacturing of 3D-NAND (VNAND) chips. Some excellent descriptions of this technology notably by Andy Walker of Schilitron Inc have appeared here on the Forum and elsewhere. Initially, there was a certain amount of skepticism….
Following on from the last post on ReRAM related news from the SPIE Advanced Lithography Conference in February, some words on a panel session on ‘Alternative Forms of Scaling’ covering the various 3D approaches to scaling.
from Andy Walker, Founder and President of Schiltron Corporation The concepts of 3D NAND and V-NAND have received so much publicity since last August that no-one should be faulted for thinking that we are on the verge of a sea-change in how high density Flash memory will be manufactured for many years to come.