IMEC and Panasonic presented a paper at the recent VLSI conference along with a corresponding press release: “Highly Reliable TaOx ReRAM with Centralized Filament for 28-nm Embedded Application” by Hayakawa, A. et al. (Panasonic) The premise seems exciting in that the authors state that they have developed….
Tag Archive: Panasonic
I’ve mentioned TechInsights in previous articles on the Forum. They provide a literally ‘unique’ service in providing a view of the insides of chips revealing much about the dimensions, materials and structure of the various components. Memory chips are no exception and their latest reports are of particular interest to the ReRAM community as
A couple of items have come my way recently. First Yole have just released a new technology and market analysis dedicated to the Emerging Non Volatile Memory. Second a paper entitled ‘Evolution of conductive filament and ….’ by a group from the…, Chinese Academy of Sciences in Beijing has just appeared in Nature’s online scientific reports.
It’s that time of year again! However, this year a little differently…. Why? Well on revisiting last year’s edition of this post, I was struck how the only successful ‘predictions’ were of the negative variety (suggestion that something that wouldn’t happen) whereas most of those that were ‘positive’ (suggested something that would happen) were wide of the mark.
Starting this week is the annual Flash Memory Summit in Santa Clara, California. Always an exciting meeting and this year is no exception. There are a couple of sessions of direct interest to the ReRAM/CBRAM community along with a panel session. Dave Eggleston,
Panasonic have announced the “world’s first mass production of ReRAM mounted microcomputers” . This appears to be the microcontroller with embedded ReRAM that was discussed in an April Blog along with its video in March.
At the 2013 ISSCC, Panasonic presented a very detailed paper on improving ReRAM endurance (specifically forming and writing) in the same session as the Toshiba/SanDisk 32Gb chip (paper 12.1). The paper presents an ReRAM analysis based on the oxidation/reduction (redox) mechanism of filament rupture and formation. The authors point to two techniques as critical in …