Developing any new technology is expensive, revolutionary technologies even more so. It is expensive to introduce new methods, materials and production techniques etc.. It is not enough just to perfect all these but one has to show the markets a compelling reason (price, performance)…..
Tag Archive: Adesto
I’ve mentioned TechInsights in previous articles on the Forum. They provide a literally ‘unique’ service in providing a view of the insides of chips revealing much about the dimensions, materials and structure of the various components. Memory chips are no exception and their latest reports are of particular interest to the ReRAM community as
It’s that time of year again! However, this year a little differently…. Why? Well on revisiting last year’s edition of this post, I was struck how the only successful ‘predictions’ were of the negative variety (suggestion that something that wouldn’t happen) whereas most of those that were ‘positive’ (suggested something that would happen) were wide of the mark.
Update At Intermolecular’s Q1 2014 conference call. more details emerged about IMI’s semiconductor related activity. Q1 was obviously tough as CDP’s with ATMI and Global Foundries as well as SanDisk/Toshiba ended and precipitated an 18% head count reduction. Ouch…. The Micron program, however continues and with Dave Lazovsky, IMI President and CEO stating “Micron’s first …
Following on from the last post on ReRAM related news from the SPIE Advanced Lithography Conference in February, some words on a panel session on ‘Alternative Forms of Scaling’ covering the various 3D approaches to scaling.
From Nicolas Baron, Co-founder and CEO, KnowMade, France. The integration limit of flash memories is approaching, and emerging Non-Volatile Memories (eNVM) to replace conventional Flash Memories have been proposed.
In a paper presented at the 2013 International Electron Devices Meeting in Washington, D.C. on Wednesday, December 11, 2013, Adesto Technologies described the high-temperature data retention characteristics