Category Archive: Technology

Feb 18

A or B? Micron’s 2016 Winter Analyst Conference

At last week’s Analyst Conference, Micron’s VP of R&D, Scott DeBoer, provided an update on Micron’s Next Generation Memory Technology. It is 6 months since the 3D Xpoint announcement last July. I was curious….

Continue reading »

Jan 28

3D Xpoint, the other shoe drops (maybe)

At last week’s Semi conference in Half Moon Bay in California, Guy Blalock Co-CEO of IM Flash Technologies (the Intel/Micron memory joint-venture, Blalock is the Micron half of the CEO duo), in what appears to be, frankly, a rather extraordinary talk, let out a few more…

Continue reading »

Oct 19

Panasonic and IMEC

IMEC and Panasonic presented a paper at the recent VLSI conference along with a corresponding press release: “Highly Reliable TaOx ReRAM with Centralized Filament for 28-nm Embedded Application” by Hayakawa, A. et al. (Panasonic) The premise seems exciting in that the authors state that they have developed….

Continue reading »

Oct 03

IEDM Taster

IEDM have issued a taster/teaser of their 2015 technical program along with session details. NVM enthusiasts will be interested in Session 10 on R(e)RAM and Session 3 which features PCRAM and Flash. Session 3….

Continue reading »

Sep 21

Micron’s Memory Roadmap: Summer 2015

It’s that time of year again! The time when Micron’s Summer Analyst Conference (usually) provides an update on the roadmap for their memory technologies….

Continue reading »

Sep 18

The Way Forward

Developing any new technology is expensive, revolutionary technologies even more so. It is expensive to introduce new methods, materials and production techniques etc.. It is not enough just to perfect all these but one has to show the markets a compelling reason (price, performance)…..

Continue reading »

Apr 21

ReRAM that you can buy (and tear apart)

I’ve mentioned TechInsights in previous articles on the Forum. They provide a literally ‘unique’ service in providing a view of the insides of chips revealing much about the dimensions, materials and structure of the various components. Memory chips are no exception and their latest reports are of particular interest to the ReRAM community as

Continue reading »

Apr 01

Micron’s Resistive Memory Roadmap

At this year’s ISSCC, there was no update from the Micron/Sony collaboration which had presented a 27nm technology 16Gb Cu CBRAM chip last year. However, there are some tantalizing titbits in their latest (2015) Winter……

Continue reading »

Mar 23

News: EUVL & 3D-NAND

deadline, what deadline

February always features two conferences important to the Semiconductor Manufacturing World: The SPIE Advanced Lithography Conference and ISSCC, EUV Lithography featured prominently at the former and an update on Samsung’s 3D-NAND was presented at the latter.

Continue reading »

Feb 10

Forecasting and Filaments

A couple of items have come my way recently. First Yole have just released a new technology and market analysis dedicated to the Emerging Non Volatile Memory. Second a paper entitled ‘Evolution of conductive filament and ….’ by a group from the…, Chinese Academy of Sciences in Beijing has just appeared in Nature’s online scientific reports.

Continue reading »

Feb 05

Part 2 of the Crystal Ball

In part 1, I gazed into the smaller company crystal ball gathering dust in my office. This time, I’ve dusted the larger version…. In terms of the memory manufacturers, 2014 was notable for the silence from…….

Continue reading »

Jan 22

Patent Alert: US8861258

A recent patent granted to SanDisk describes a Set/reset algorithm which detects and repairs weak cells in resistive-switching memory device”. One of the inventors was kind enough to alert me to this and describes the importance as follows:

Continue reading »

Jan 15

Crystal Ball Gazing (again) Part 1 (of 2 maybe)

It’s that time of year again! However, this year a little differently…. Why? Well on revisiting last year’s edition of this post, I was struck how the only successful ‘predictions’ were of the negative variety (suggestion that something that wouldn’t happen) whereas most of those that were ‘positive’ (suggested something that would happen) were wide of the mark.

Continue reading »

Jan 06

Samsung 3D-NAND aka VNAND

Samsung were well ahead of their competitors in the mass memory market when they announced the volume manufacturing of 3D-NAND (VNAND) chips. Some excellent descriptions of this technology notably by Andy Walker of Schilitron Inc have appeared here on the Forum and elsewhere. Initially, there was a certain amount of skepticism….

Continue reading »

Dec 19

Access/Select Devices at IEDM

It’s IEDM week and from my position on the other side of the Pond (i.e. I’m not at the conference), it’s clear that interest in ReRAM and CBRAM continues. However, this year there are more papers focussing on the access device suitable for use in next generation memory. This actually makes a lot of sense because…..

Continue reading »

Older posts «