Monthly Archive: April 2013

Apr 30

Intermolecular Update!

Intermolecular’s (IMI) Q1 Earnings Results and Conference Call threw some more light on their activities in the ReRAM and memory fields along with another puzzle. Dave Lazovsky, IMI CEO, announced they have signed a multi-year Collaborative Development Program (CDP) and IP licensing agreement with

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Apr 24

Wright’s Law

No, I confess I had not heard of it either. It turns out that there are a number of ‘laws’ that purport to predict the evolution of technologies. In the semiconductor business we are only too familiar with Moore’s law

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Apr 18

More from Panasonic


At the 2013 ISSCC, Panasonic presented a very detailed paper on improving ReRAM endurance (specifically forming and writing) in the same session as the Toshiba/SanDisk 32Gb chip (paper 12.1). The paper presents an ReRAM analysis based on the oxidation/reduction (redox) mechanism of filament rupture and formation. The authors point to two techniques as critical in …

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Apr 12

Adesto Technologies Workshop on Non-volatile Memory Solutions


When: Thursday, April 25 11:45 am to 2:00 pm Where: St. Claire Hotel, 302 South Market St., San Jose, CA (next to the San Jose Convention Center)

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Apr 11

Panasonic’s ReRAM MCU

Pansonic ReRAM MCU

At the 2013 Embedded World Exhibition at the end of February in Nuremberg, Panasonic announced their ReRAM containing MCU. Fortunately for those of you who missed this (as I did), Panasonic have a virtual booth available online

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Apr 03


Like all the big memory companies, Micron invests a lot of time, money and resources into R&D pushing existing technology and developing ‘what comes next’ technology. Micron have a reputation for being at the forefront and, while not much is openly disclosed

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