Dec 31

Meetings of Interest to the ReRAM/CBRAM Community


Latest Update, 10/3/15: 8th IMW, 7th NVMW, IEDM 2015, Advances in ReRAM: Materials & Interfaces
If you are aware of an upcoming meeting or conference, please post a comment or contact the moderator.

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Oct 19

Panasonic and IMEC

IMEC and Panasonic presented a paper at the recent VLSI conference along with a corresponding press release: “Highly Reliable TaOx ReRAM with Centralized Filament for 28-nm Embedded Application” by Hayakawa, A. et al. (Panasonic) The premise seems exciting in that the authors state that they have developed….

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Oct 03

IEDM Taster

IEDM have issued a taster/teaser of their 2015 technical program along with session details. NVM enthusiasts will be interested in Session 10 on R(e)RAM and Session 3 which features PCRAM and Flash. Session 3….

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Sep 21

Micron’s Memory Roadmap: Summer 2015

It’s that time of year again! The time when Micron’s Summer Analyst Conference (usually) provides an update on the roadmap for their memory technologies….

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Sep 18

The Way Forward

Developing any new technology is expensive, revolutionary technologies even more so. It is expensive to introduce new methods, materials and production techniques etc.. It is not enough just to perfect all these but one has to show the markets a compelling reason (price, performance)…..

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Jul 29

3D XPoint is here… Or next year (maybe)

Things have been rather quiet recently on the next generation memory/storage front, when suddenly, out of the blue, there is a dramatic announcement from the ~10 yr old Micron/Intel NVM collaboration. At a rather spartan 45min press conference/webcast….

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Jun 09

Advances in ReRAM : Materials & Interfaces, 11-16 October, 2015

The workshop is focused on the role of the interfaces in nanoscale ReRAMs and on new approaches and materials, and how these can be facilitated through the modern nanotechnology.

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Jun 01

DESTINY: A Tool for Modeling Emerging 3D NVM and eDRAM caches

To drive architecture and system-level studies into 3D ReRAM and other emerging memory technologies, a group of researchers at Oak Ridge National Lab, Penn State and UCSB have developed a modeling tool named DESTINY. DESTINY is an acronym for 3D dEsign-Space exploraTIon tool for SRAM, eDRAM and Non-volatile memorY.

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Apr 21

ReRAM that you can buy (and tear apart)

I’ve mentioned TechInsights in previous articles on the Forum. They provide a literally ‘unique’ service in providing a view of the insides of chips revealing much about the dimensions, materials and structure of the various components. Memory chips are no exception and their latest reports are of particular interest to the ReRAM community as

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Apr 01

Micron’s Resistive Memory Roadmap

At this year’s ISSCC, there was no update from the Micron/Sony collaboration which had presented a 27nm technology 16Gb Cu CBRAM chip last year. However, there are some tantalizing titbits in their latest (2015) Winter……

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Mar 23

News: EUVL & 3D-NAND

deadline, what deadline

February always features two conferences important to the Semiconductor Manufacturing World: The SPIE Advanced Lithography Conference and ISSCC, EUV Lithography featured prominently at the former and an update on Samsung’s 3D-NAND was presented at the latter.

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Feb 10

Forecasting and Filaments

A couple of items have come my way recently. First Yole have just released a new technology and market analysis dedicated to the Emerging Non Volatile Memory. Second a paper entitled ‘Evolution of conductive filament and ….’ by a group from the…, Chinese Academy of Sciences in Beijing has just appeared in Nature’s online scientific reports.

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Feb 05

Part 2 of the Crystal Ball

In part 1, I gazed into the smaller company crystal ball gathering dust in my office. This time, I’ve dusted the larger version…. In terms of the memory manufacturers, 2014 was notable for the silence from…….

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Jan 22

Patent Alert: US8861258

A recent patent granted to SanDisk describes a Set/reset algorithm which detects and repairs weak cells in resistive-switching memory device”. One of the inventors was kind enough to alert me to this and describes the importance as follows:

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Jan 15

Crystal Ball Gazing (again) Part 1 (of 2 maybe)

It’s that time of year again! However, this year a little differently…. Why? Well on revisiting last year’s edition of this post, I was struck how the only successful ‘predictions’ were of the negative variety (suggestion that something that wouldn’t happen) whereas most of those that were ‘positive’ (suggested something that would happen) were wide of the mark.

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Jan 06

Samsung 3D-NAND aka VNAND

Samsung were well ahead of their competitors in the mass memory market when they announced the volume manufacturing of 3D-NAND (VNAND) chips. Some excellent descriptions of this technology notably by Andy Walker of Schilitron Inc have appeared here on the Forum and elsewhere. Initially, there was a certain amount of skepticism….

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