Blog

Millionth, MegaBytes and Machine

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News from HP, Crossbar and Adesto Technologies (Blog sponsor) who have just announced the shipment of their millionth CBRAM product. Quite a milestone for a next generation technology product

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Patent Landscape by Blaise Mouttet

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Blaise Mouttet is an interesting guy who runs a nanotech blog focused on IP  including ReRAM. He has just updated his study on US patents related to Resistance Switching Materials and Devices. There is a huge amount of analysis and information in this …

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Meetings of Interest to the ReRAM/CBRAM Community

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Latest Update: ASM International Technology seminar on Technology for advanced embedded memory applications, 5/21/2014, Leti Memory Workshop, 6/24/2014,

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Embedded NVM for IoT will lead the way with Standalone memory to follow

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from Lucian Shifren, Principal Engineer, ARM Inc. While many options exist to extend the roadmap for standalone FLASH (such as vertical FLASH), embedded FLASH has a much shorter runway. While standalone FLASH can be optimized for memory function, embedded FLASH needs

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Updated(!) News Update: Intermolecular, Nanoimprint and Adesto

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Update At Intermolecular’s Q1 2014 conference call. more details emerged about IMI’s semiconductor related activity. Q1 was obviously tough as CDP’s with ATMI and Global Foundries as well as SanDisk/Toshiba ended and precipitated an 18% head count reduction. Ouch…. The Micron program, however …

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An Interview with Andy Walker

Andy Walker

Andy Walker is Founder and President of Schiltron Corporation, Mountain View, California. Please tell us a little about Schiltron Corporation? Schiltron Corporation is a Silicon Valley startup funded to investigate options for 3D

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Patent Alert

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Memory Cell with Threshold Switch (US8642985) by Frederick T. Chen. A high-density resistive memory traditionally coupled a transistor and a switching resistance in the same cell. While the functionality was easy to predict with this configuration, the density is often compromised by the …

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ReRAM at SPIE

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Following on from the last post on ReRAM related news from the SPIE Advanced Lithography Conference in February, some words on a panel session on ‘Alternative Forms of Scaling’ covering the various 3D approaches to scaling.

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SPIE Advanced Lithography Conference

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The SPIE Litho conference every February is one of the things I really miss being located this side of the Pond. I used to attend regularly starting when it was held at the San Jose Fairmont. I was involved in running one of …

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Vertical Channel 3D NAND – An Optical Illusion?

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from Andy Walker, Founder and President of Schiltron Corporation The concepts of 3D NAND and V-NAND have received so much publicity since last August that no-one should be faulted for thinking that we are on the verge of a sea-change in how high …

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Discover our new Patent Landscape on Emerging Non-Volatile Memories

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From Nicolas Baron, Co-founder and CEO, KnowMade, France. The integration limit of flash memories is approaching, and emerging Non-Volatile Memories (eNVM) to replace conventional Flash Memories have been proposed.

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ISSCC 2014

Sony Cell

Highlights from this year’s ISSCC conference included more details of the Sony/Micron 16Gb ReRAM chip and Samsung’s 3D NAND (V-NAND) chip both of which have featured in recent Forum blogs. The Sony/Micron chip is more accurately described as

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Comments

Comments

Comments on Blog posts are extremely welcome at ReRAM-Forum but if you find that you are unable to leave a comment, please submit it via the ‘CONTACT THE MODERATOR’ link including the title of the Post.

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Update on CeRAM and Acronyms

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Following last month’s post here on CeRAM being developed by Symetrix Corporation, various stories have appeared indicating that ARM

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Crystal Ball Gazing

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It’s that time of year again… Time to dust off that ol’ crystal ball and gaze into the murky depths and come up with the ReRAM-Forum predictions for the rest of 2014!

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